Abstract The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology) for three independent factors was applied, i.e. pH, the concentration of Fe(II) and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

中文翻译：

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UV-Fenton法去除印刷电路板生产废水中的有机物

摘要 提出了通过在第一阶段使用废酸化和处理沉淀的光聚合物以及在第二阶段使用 UV-Fenton 方法去除印刷电路板光化学生产废水中有机化合物的可能性。为了优化高级氧化过程，应用了三个独立因素的 RSM（响应面方法），即 pH、Fe(II) 浓度和 H2O2 浓度。在废水处理过程中使用各个参数的优化值导致表示为 COD 的有机化合物的浓度降低了约 第一阶段为 87%，大约为 87%。应用这两种工艺后 98%。有机化合物的沉淀和分解与废水 COD 降低至低于 100 mg O2/L 相关，而初始值为 5550 mg O2/L。还使用替代的 H2O2 源（即 CaO2、MgO2 和 Na2CO3·1,5H2O2）进行了有机化合物的分解和开发的光聚合物去除模型的验证。