Redundancy is a well-known technique for replacing components with manufacturing defects, improving yield and reducing cost. Previously, most yield improvement strategies utilized redundant components only when another component had failed (i.e., cold spares). However, utilizing hot spares is becoming popular in commercial products (e.g., the NVIDIA Ti GPU series). Hot spares address manufacturing cost when the components are defective; otherwise, they can be used to improve performance in the field. In this paper, we investigate the effect of hot spares on lifetime-chip-performance (LCP) in multi-core single-instruction, multiple-thread (SIMT) processors. We observe that hot sparing is outstandingly effective for specific types of SIMT processor configurations (small and medium systems) and applications (FFT and FILTER), while improving cost and LCP over other configurations and applications as well. For example, hot-sparing can improve LCP more than 75% compared with conventional methods (i.e., cold sparing), on average, for applications that experience significant performance improvement when adding hot spares (e.g., FFT and FILTER). In particular, microarchitectural hot redundant resources (e.g., hot spare lanes) achieve better LCP improvement than conventional architectural redundancies (e.g., hot spare cores).

冗余是一种众所周知的技术，可用来替换具有制造缺陷的组件，提高产量并降低成本。以前，大多数良率提高策略仅在另一个组件发生故障（例如，冷备件）时才使用冗余组件。但是，利用热备件在商业产品（例如NVIDIA TiGPU系列）。当零件出现故障时，热备件可解决制造成本；否则，它们可用于提高现场性能。在本文中，我们研究了热备件对多核单指令多线程（SIMT）处理器中的生命周期芯片性能（LCP）的影响。我们观察到，热备用对于特定类型的SIMT处理器配置（中小型系统）和应用程序（FFT和FILTER）非常有效，同时与其他配置和应用程序相比，还改善了成本和LCP。例如，对于在添加热备份（例如FFT和FILTER）时性能得到显着改善的应用程序，平均而言，与传统方法（即冷备用）相比，热保留可以将LCP改善75％以上。尤其是，