Abstract. A single-chip microelectromechanical system (MEMS) capacitive microphone is designed and modeled. The mechanical model of the structure is extracted and the mathematical equations for a description of the microphone behavior are obtained. Then the proposed microphone characteristics are considered. In this structure, by adding Z-shape arms around the diaphragm, diaphragm hardness is decreased and diaphragm displacement becomes uniform. The sensitivity and the pull-in voltage are improved despite the decreasing size. The perforated diaphragm of this microphone is supported by Z-shape arms at its four corners. These arms around the diaphragm decrease the stiffness and air damping of the microphone. The behavior of this microphone is also analyzed by the finite element method. The structure has a diaphragm thickness of 2  μm, a diaphragm size of 0.32  ×  0.32  mm2, an air gap of 2  μm, and a highly doped monocrystalline silicon wafer as a backplate. The proposed microphone is simulated with IntelliSuite software. According to the results, the new microphone has a sensitivity of 14.245  mV  /  Pa and a pull-in voltage of 5.83 V. The results show that the proposed MEMS capacitive microphone is one of the best structures in performance. The obtained mathematical equations for description of the microphone’s behavior have good agreement with the simulation results.

中文翻译：

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高灵敏度微机电系统电容式麦克风的设计与建模

摘要。设计并建模了一种单芯片微机电系统 (MEMS) 电容式麦克风。提取结构的机械模型，并获得描述麦克风行为的数学方程。然后考虑建议的麦克风特性。在这种结构中，通过在膜片周围添加 Z 形臂，膜片硬度降低，膜片位移变得均匀。尽管尺寸减小，但灵敏度和吸合电压有所提高。该麦克风的穿孔隔膜由四个角的 Z 形臂支撑。这些围绕膜片的臂降低了麦克风的刚度和空气阻尼。该麦克风的行为也通过有限元方法进行了分析。该结构的隔膜厚度为 2 μm，隔膜尺寸为 0.32 × 0.32 mm2，气隙为 2 μm，高掺杂单晶硅片作为背板。建议的麦克风使用 IntelliSuite 软件进行模拟。根据结果​​，新麦克风的灵敏度为14.245 mV/Pa，吸合电压为5.83 V。结果表明，所提出的MEMS电容式麦克风是性能最好的结构之一。得到的用于描述麦克风行为的数学方程与仿真结果吻合良好。结果表明，所提出的MEMS电容式麦克风是性能最好的结构之一。得到的用于描述麦克风行为的数学方程与仿真结果吻合良好。结果表明，所提出的MEMS电容式麦克风是性能最好的结构之一。得到的用于描述麦克风行为的数学方程与仿真结果吻合良好。