Recent advancements in electronics have renewed the interest in high strain rate nanoindentation testing, resulting in the development of new high strain rate nanoindentation test equipment and test methodologies. In this work, the current state-of-the-art in high strain rate nanoindentation testing is critically reviewed, with focus on three key aspects - the testing equipment's dynamic mechanical and electronic response, test methodology, and post-processing of raw data to obtain hardness and strain rate. The challenges in instrument hardware design and post-test data analysis are discussed, along with optimal strain rate window for accurate high strain rate measurements. Specific focus will be on instrumented high strain rate testing using self-similar indenters at strain rates in excess of 100 s⁻¹, wherein load and depth of penetration into the sample are both measured or applied.

电子学的最新进展重新引起了人们对高应变率纳米压痕测试的兴趣，从而开发了新的高应变率纳米压痕测试设备和测试方法。在这项工作中，对高应变率纳米压痕测试的最新技术进行了严格审查，重点放在三个关键方面——测试设备的动态机械和电子响应、测试方法和原始数据的后处理获得硬度和应变率。讨论了仪器硬件设计和测试后数据分析方面的挑战，以及用于精确高应变率测量的最佳应变率窗口。具体重点将放在使用自相似压头以超过 100 s ^{−1的应变率进行仪器化高应变率测试}，其中负载和渗透到样品中的深度都被测量或施加。