Purpose

The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the continuous market requirement. Because of demand and trends, new package structures that can accommodate many pins (I/Os) while maintaining the excellent thermal and electrical properties of the leadframe package was studied. Different from conventional leadframe and laminate packages, it must have the large-exposed pad for thermal dissipation and design flexibility to deploy signal, ground and power selectively.

Design/methodology/approach

In this study, the routable molded leadframe (rtMLF®) package applying the pre-resin MLF substrate was introduced. The structural advantages, in terms of design flexibility, were checked by adopting the specific electrical feature. Also, the excellence of thermal and electrical performance was confirmed by simulation. The sample was manufactured, and its package robustness was validated by reliability test.

Findings

rtMLF package that enables one layer substrate but routable pattern on top layer differently from existing leadframe package was developed and studied if it overcome the limitations of leadframe and laminate products. Asymmetric land layout was designed and special features to keep electrical interference was applied to prove design flexibility. The thermal and electrical simulation has been executed to check the advantages. And key differentiations were identified. Finally, actual sample was manufactured, and structural robustness was validated by package level and board level reliability.

Originality/value

The differentiation of new semiconductor package was introduced and its excellence was verified by electrical and thermal simulation as well as reliability test. It is expected to be adopted for alternative solutions not covered by the existing products.

中文翻译：

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先进的无引线引线框架封装及其特点

目的

本研究的目的是根据持续的市场需求，提供先进的无引线引线框架封装，实现小尺寸和高热性能和电气性能。由于需求和趋势，人们研究了可以容纳许多引脚 (I/O) 同时保持引线框封装出色的热性能和电气性能的新型封装结构。与传统的引线框和层压封装不同，它必须具有用于散热和设计灵活性的大面积外露焊盘，以便有选择地部署信号、接地和电源。

设计/方法/途径

在本研究中，介绍了应用预树脂 MLF 基板的可布线模制引线框 (rtMLF®) 封装。通过采用特定的电气特性，检查了设计灵活性方面的结构优势。此外，仿真还证实了出色的热性能和电气性能。制造样品，并通过可靠性测试验证其封装稳健性。

发现

如果能够克服引线框和层压产品的局限性，开发和研究了 rtMLF 封装，该封装能够实现一层基板但顶层的可布线图案不同于现有的引线框封装。设计了不对称的焊盘布局，并应用了保持电气干扰的特殊功能来证明设计的灵活性。已执行热和电气仿真以检查优势。并确定了关键差异。最后，制造了实际样品，并通过封装级和板级可靠性验证了结构稳健性。

原创性/价值

介绍了新半导体封装的差异化，并通过电气和热仿真以及可靠性测试验证了其卓越性。预计将被现有产品未涵盖的替代解决方案采用。