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Numerical investigation of graphene-silica-silver based VLSI interconnects with tunable multiband infrared absorber for 3D integrated circuits
Journal of Nanophotonics ( IF 1.5 ) Pub Date : 2023-02-01 , DOI: 10.1117/1.jnp.17.016008
Sivakumar Sabapathy Arumugam 1
Affiliation  

We propose the multilayer silver-silica-graphene-based very large-scale integration interconnects assisted by a tunable perfect absorption structure over the infrared frequency spectrum of the third window of the optical communication for three-dimensional (3D) integrated circuits (ICs). This absorber is numerically investigated for the different cylindrical silver resonator-based squared geometries. The overall structure is investigated for the wavelength range of 1.4 to 1.6 μm over the infrared spectrum. The adjustable behavior of the absorption spectrum is observed when this structure is studied for various chemical potentials of the graphene sheet. We also present the electric and magnetic field intensity for the nearly perfect absorption conditions to identify the effect of energy concentration over different pixel structures and wavelengths. We also showcased the possible fabrication process for the proposed numerical investigation analysis. Resonator height and width have also been simulated numerically to find the resonance shift in the absorber. The adaptable behavior of the suggested structure has potential applications in a wide range of scientific fields, including biosensors, solar absorbers, optical communication, and the fabrication of 3D ICs. Simulations are performed using the COMSOL Multiphysics software module

中文翻译:

用于 3D 集成电路的具有可调多波段红外吸收器的石墨烯-二氧化硅-银基 VLSI 互连的数值研究

我们提出了基于多层银-二氧化硅-石墨烯的超大规模集成互连,该互连由三维 (3D) 集成电路 (IC) 光通信第三窗口的红外频谱上的可调完美吸收结构辅助。该吸收器针对不同的基于圆柱形银谐振器的方形几何形状进行了数值研究。在红外光谱范围内研究了 1.4 至 1.6 μm 波长范围内的整体结构。当针对石墨烯片的各种化学势研究该结构时,观察到吸收光谱的可调行为。我们还展示了近乎完美的吸收条件下的电场和磁场强度,以确定能量集中对不同像素结构和波长的影响。我们还展示了所提出的数值调查分析的可能制造过程。还对谐振器的高度和宽度进行了数值模拟,以找出吸收器中的谐振位移。所建议结构的适应性行为在广泛的科学领域具有潜在的应用,包括生物传感器、太阳能吸收器、光通信和 3D IC 的制造。使用 COMSOL Multiphysics 软件模块进行仿真 光通信和 3D IC 的制造。使用 COMSOL Multiphysics 软件模块进行仿真 光通信和 3D IC 的制造。使用 COMSOL Multiphysics 软件模块进行仿真
更新日期:2023-02-01
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