This introduction welcomes all readers to this ACM JETC special issue on CAD for Security: Pre-silicon Security Sign-off Solutions Through Design Cycle. The articles published in this special issue reflect how computer-aided design (CAD) tools are developed to expand the notion of automated security verification throughout the system-on-chip (SoC) design cycle. This special issue aims to demonstrate how the semiconductor industry must look for security-oriented metrics and evaluation as part of automatic CAD solution development to aid analysis, identifying, root-causing, and mitigating SoC security problems. Throughout this introductory note, we first represent the need for such a security-oriented sign-off solution for the ASIC design flow, then it is followed by providing an overview of the articles published in this special issue and how they address such requirements.

本简介欢迎所有读者阅读本 ACM JETC 安全 CAD 特刊：通过设计周期的硅前安全签名解决方案。本期特刊中发表的文章反映了如何开发计算机辅助设计 (CAD) 工具以在整个片上系统 (SoC) 设计周期中扩展自动安全验证的概念。本期特刊旨在展示半导体行业必须如何寻找面向安全的指标和评估作为自动 CAD 解决方案开发的一部分，以帮助分析、识别、根本原因和缓解 SoC 安全问题。在本介绍性说明中，我们首先表示 ASIC 设计流程需要这种面向安全的签核解决方案，