Abstract

Efforts to improve the properties of composites have involved extensive studies regarding the effective incorporation of a polymer matrix and inorganic fillers. In this work, we generated a stable organosilica sol with high concentration and high purity by surface modification with silane coupling agents, then integrated it with an epoxy matrix. The silica nanoparticle/epoxy composite exhibited improved tensile strength because of the uniform distribution of silica in the matrix, as well as the interfacial chemical bonding between polymer and silica nanoparticles; these factors resulted in effective load transfer from matrix to fillers. Additionally, the application of copper-clad laminates (CCLs) with prepreg-containing silica nanoparticles led to substantial improvements in mechanical properties, including peel strength (0.46 kgf/cm) and storage modulus (30.0 GPa), compared with conventional CCLs lacking silica nanoparticles. These results suggest that prepregs containing surface-modified silica nanoparticles have great potential for use as printed circuit board substrate materials in high-performance electronics.

Graphical Abstract

中文翻译：

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硅烷偶联剂处理二氧化硅纳米粒子填充高性能覆铜板的研究

摘要

为了改善复合材料的性能，人们对聚合物基体和无机填料的有效结合进行了广泛的研究。在这项工作中，我们通过硅烷偶联剂进行表面改性，生成了稳定的高浓度、高纯度的有机硅溶胶，然后将其与环氧基质集成。由于二氧化硅在基体中的均匀分布以及聚合物和二氧化硅纳米颗粒之间的界面化学键合，二氧化硅纳米颗粒/环氧树脂复合材料表现出更高的拉伸强度；这些因素导致负载从基体有效转移到填料。此外，使用含有二氧化硅纳米颗粒的预浸料的覆铜层压板 (CCL) 显着改善了机械性能，包括剥离强度 (0. 与缺乏二氧化硅纳米粒子的传统 CCL 相比，其具有 46 kgf/cm）和储能模量（30.0 GPa）。这些结果表明，含有表面改性二氧化硅纳米粒子的预浸料具有用作高性能电子产品中印刷电路板基材材料的巨大潜力。

图形概要