ABSTRACT

Room-temperature welding with gallium is regarded as a new strategy because of the low melting point of gallium and its affinity for forming intermetallic compounds with other metals. Benefitting from liquid gallium-based solder and an ultrasonic drive, the establishment of Cu/Cu diffusion-bond connections can be quickly completed. The underlying characteristics for the weld quality of room-temperature bonding were preliminarily clarified from the perspectives of welding process parameters and the solder composition. To further determine these characteristics, the research directions including features of welding product formed by ultrasonic-driven room-temperature bonding, the interface microstructure, the element distribution and the shear strength of the weld joint were then determined.

摘要

由于镓的熔点低且易于与其他金属形成金属间化合物，因此室温镓焊接被认为是一种新策略。受益于液态镓基焊料和超声波驱动，可以快速完成铜/铜扩散键连接的建立。从焊接工艺参数和焊料成分的角度初步阐明了室温键合焊接质量的基本特征。为了进一步确定这些特征，确定了超声驱动室温连接焊接产品的特征、界面显微组织、元素分布和焊接接头的剪切强度等研究方向。