ABSTRACT

In this study, the surface properties of copper layers on a zirconium substrate were investigated. The copper deposits with thicknesses of 25, 50, and 100 μm were formed using the electroplating method. The evaluations of coating thickness, surface morphology, crystallite size, and grain distribution were performed by using the relevant analytical equipment. The results showed that by increasing the thickness of the copper layer, a more uniform cauliflower morphology was obtained. Also, by increasing the thickness of the copper deposit, the crystallite size was decreased from 70 to 20 nanometers and the strain energy was decreased from 2.9 × 10⁻³ J to 6.5 × 10⁻³ J. The copper layer with a thickness of 100 μm was the most wear resistance compared to other coatings. The highest hardness value, uniform morphology, and more twin islands in different areas were the main reasons for improving the wear resistance of the copper layer with a thickness of 100 μm.

摘要

在这项研究中，研究了锆基材上铜层的表面特性。采用电镀方法形成厚度为25、50和100μm的铜沉积物。利用相关分析设备对涂层厚度、表面形貌、微晶尺寸和晶粒分布进行评价。结果表明，通过增加铜层的厚度，可以获得更均匀的菜花形貌。此外，通过增加铜沉积物的厚度，微晶尺寸从70纳米减小到20纳米，应变能从2.9×10 -3 ^J减小到6.5×10 ^-3J.与其他涂层相比，厚度为100μm的铜层最耐磨。最高的硬度值、均匀的形貌以及不同区域较多的孪晶岛是100μm厚铜层耐磨性提高的主要原因。