The effect of impurities in the Cu film on the void formation at the interface of the Sn-rich solder joint has been extensively studied. However, this has rarely been studied for In solder joints. ...

中文翻译：

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In 和高杂质 Cu 接头之间的无空隙界面

铜膜中的杂质对富锡焊点界面空洞形成的影响已被广泛研究。然而，很少有人对 In 焊点进行研究。...