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Smallest form-factor multi-stacked ceramic patch antenna on package for 5G millimeter-wave mobile applications
Photonics and Nanostructures - Fundamentals and Applications ( IF 2.7 ) Pub Date : 2023-09-30 , DOI: 10.1016/j.photonics.2023.101189
Sung Yong An , Boumseock Kim

A new design for a 5G millimeter-wave array antenna that is only 2.8 mm wide, using multi-stacked high-temperature ceramic substrates, is proposed in this paper. The antenna is designed to meet the requirements for esthetically pleasing and ergonomic smartphone designs and efficient component installations. To overcome challenges posed by the high relative permittivity and dielectric loss tangent of the ceramic substrates, the authors use a polymer adhesion layer with an air cavity and U-shaped probe feeding structures. The resulting 1 × 5 ceramic array antenna has a −10 dB impedance bandwidth in the low-band range of 24.25–28.35 GHz and the high-band range of 37–40 GHz, which covers the 5G New Radio frequency ranges n258, n260, and n261.



中文翻译:

适用于 5G 毫米波移动应用的最小封装多堆叠陶瓷贴片天线

本文提出了一种宽度仅为2.8毫米、采用多层堆叠高温陶瓷基板的5G毫米波阵列天线的新设计。该天线的设计旨在满足美观且符合人体工学的智能手机设计以及高效组件安装的要求。为了克服陶瓷基板的高相对介电常数和介电损耗角正切带来的挑战,作者使用了带有空气腔和 U 形探针馈送结构的聚合物粘合层。由此产生的1×5陶瓷阵列天线在24.25-28.35 GHz的低频段范围和37-40 GHz的高频段范围内具有−10 dB阻抗带宽,涵盖5G新射频范围n258、n260、和n261。

更新日期:2023-09-30
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