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Balancing Performance Against Cost and Sustainability in Multi-Chip-Module GPUs
IEEE Computer Architecture Letters ( IF 2.3 ) Pub Date : 2023-09-08 , DOI: 10.1109/lca.2023.3313203
Shiqing Zhang 1 , Mahmood Naderan-Tahan 1 , Magnus Jahre 2 , Lieven Eeckhout 1
Affiliation  

MCM-GPUs scale performance by integrating multiple chiplets within the same package. How to partition the aggregate compute resources across chiplets poses a fundamental trade-off in performance versus cost and sustainability. We propose the Performance Per Wafer (PPW) metric to explore this trade-off and we find that while performance is maximized with few large chiplets, and while cost and environmental footprint is minimized with many small chiplets, the optimum balance is achieved with a moderate number of medium-sized chiplets. The optimum number of chiplets depends on the workload and increases with increased inter-chiplet bandwidth.

中文翻译:

平衡多芯片模块 GPU 的性能与成本和可持续性

MCM-GPU 通过在同一封装内集成多个小芯片来扩展性能。如何跨小芯片划分聚合计算资源构成了性能与成本和可持续性之间的基本权衡。我们建议我们使用每晶圆性能 (PPW) 指标来探索这种权衡,我们发现,虽然通过少量大芯片实现了性能最大化,同时通过许多小芯片实现了成本和环境足迹最小化,但通过适度数量的中型芯片实现了最佳平衡。大小的小芯片。小芯片的最佳数量取决于工作负载,并随着小芯片间带宽的增加而增加。
更新日期:2023-09-08
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