This study investigated the surface modification of copper mesh using modified titanium dioxide (TiO₂) coatings to enhance its surface hydrophobic properties while preserving electromagnetic interference (EMI) shielding effectiveness. Silicon-coupling-agent-treated titanium dioxide particles were employed to create micro/nanostructured superhydrophobic coatings. The deposition times were found to influence the coating distribution, pore filling and surface hydrophobicity. S-TiO₂@Cu mesh with a single layer of modified titanium dioxide coating exhibited the highest water contact angle compared with T-TiO₂@Cu mesh with triple layer coatings and the original O-TiO₂@Cu mesh. The superior self-cleaning performance and robust wear resistance of the hydrophobic coatings for S-TiO₂@Cu mesh were revealed. In addition, both S-TiO₂@Cu mesh and T-TiO₂@Cu mesh exhibited satisfactory EMI-shielding efficiency without compromising the intrinsic properties of the copper mesh. These findings provide practical insights into surface modification of copper mesh substrates, emphasizing the balance between surface properties and EMI shielding. The hydrophobic coatings hold promise for multifunctional applications, offering enhanced surface properties without compromising EMI-shielding performance.

中文翻译：

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令人印象深刻的疏水性 TiO2@Cu 网，用于电磁干扰屏蔽

本研究研究了使用改性二氧化钛 (TiO ₂ ) 涂层对铜网进行表面改性，以增强其表面疏水性，同时保持电磁干扰 (EMI) 屏蔽效果。采用硅偶联剂处理的二氧化钛颗粒来创建微/纳米结构超疏水涂层。研究发现沉积时间会影响涂层分布、孔隙填充和表面疏水性。与具有三层涂层的T-TiO ₂ @Cu网和原始O-TiO ₂ @Cu网相比，具有单层改性二氧化钛涂层的S-TiO _{2 @Cu网表现出最高的水接触角。 S-TiO 2} @Cu网疏水涂层具有优异的自清洁性能和强大的耐磨性。此外，S-TiO ₂ @Cu网和T-TiO ₂ @Cu网均表现出令人满意的EMI屏蔽效率，且不影响铜网的固有性能。这些发现为铜网基材的表面改性提供了实用的见解，强调了表面特性和 EMI 屏蔽之间的平衡。疏水涂层有望实现多功能应用，在不影响 EMI 屏蔽性能的情况下提供增强的表面性能。