Miniaturization and enhanced performance of microchips has resulted in powerful electronic devices with high heat flux components. For these advanced electronics, the current heat transfer method of single-phase forced convection is reaching its thermal limit and more effective cooling solutions are needed. A pumped two-phase loop, in which a pump circulates a working fluid that evaporates to absorb heat, can offer a solution. In this paper the cooling performance of a pumped two-phase loop is discussed and validated. A numerical tool has been developed to aid in designing a fit-for-purpose pumped two-phase loop and to predict its behaviour to changing system parameters and heat inputs. Results from the numerical model are compared with temperature, pressure and flow velocity measurements obtained from a prototype setup. The effects of applying varying heat loads on both a single evaporator and on multiple evaporators simultaneously either in series or in parallel have been investigated. Heat transfer coefficients between 7 and 10 kW/m²K were obtained during the experiments. Model predictions correspond well to the measured performances and findings on the two-phase boiling behaviour are presented. The model is particularly useful for the rapid assessment of the layout of a pumped two-phase loop for high heat flux electronics cooling.

微芯片的小型化和性能的增强带来了具有高热通量组件的强大电子设备。对于这些先进的电子产品，当前的单相强制对流传热方法已达到其热极限，需要更有效的冷却解决方案。泵送两相回路可以提供一种解决方案，其中泵循环工作流体，工作流体蒸发以吸收热量。本文讨论并验证了泵送两相回路的冷却性能。我们开发了一种数值工具来帮助设计适合用途的泵送两相回路并预测其随系统参数和热输入变化的行为。将数值模型的结果与原型装置获得的温度、压力和流速测量结果进行比较。已经研究了在单个蒸发器和同时串联或并联的多个蒸发器上施加变化的热负荷的影响。实验期间获得了7 至 10 kW/m ² K之间的传热系数。模型预测与测量的性能很好地对应，并且提出了两相沸腾行为的发现。该模型对于快速评估用于高热通量电子设备冷却的泵送两相回路的布局特别有用。