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PECVD and PEALD on polymer substrates (part II): Understanding and tuning of barrier and membrane properties of thin films
Plasma Processes and Polymers ( IF 3.5 ) Pub Date : 2023-11-27 , DOI: 10.1002/ppap.202300186
Teresa de los Arcos 1 , Peter Awakowicz 2 , Marc Böke 3 , Nils Boysen 4, 5 , Ralf Peter Brinkmann 6 , Rainer Dahlmann 7 , Anjana Devi 4, 5 , Denis Eremin 6 , Jonas Franke 7 , Tobias Gergs 8 , Jonathan Jenderny 2 , Efe Kemaneci 6 , Thomas D. Kühne 9 , Simon Kusmierz 7 , Thomas Mussenbrock 8 , Jens Rubner 10 , Jan Trieschmann 11 , Matthias Wessling 10, 12 , Xiaofan Xie 1 , David Zanders 4 , Frederik Zysk 9 , Guido Grundmeier 1
Affiliation  

This feature article presents insights concerning the correlation of plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition thin film structures with their barrier or membrane properties. While in principle similar precursor gases and processes can be applied, the adjustment of deposition parameters for different polymer substrates can lead to either an effective diffusion barrier or selective permeabilities. In both cases, the understanding of the film growth and the analysis of the pore size distribution and the pore surface chemistry is of utmost importance for the understanding of the related transport properties of small molecules. In this regard, the article presents both concepts of thin film engineering and analytical as well as theoretical approaches leading to a comprehensive description of the state of the art in this field. Perspectives of future relevant research in this area, exploiting the presented correlation of film structure and molecular transport properties, are presented.

中文翻译:

聚合物基材上的 PECVD 和 PEALD(第二部分):理解和调整薄膜的阻隔和膜特性

这篇专题文章提出了有关等离子体增强化学气相沉积和等离子体增强原子层沉积薄膜结构与其阻隔或膜特性之间的相关性的见解。虽然原则上可以应用类似的前体气体和工艺,但调整不同聚合物基底的沉积参数可以产生有效的扩散阻挡层或选择性渗透率。在这两种情况下,对薄膜生长的理解以及对孔径分布和孔表面化学的分析对于理解小分子的相关传输特性至关重要。在这方面,本文介绍了薄膜工程和分析以及理论方法的概念,从而全面描述了该领域的最新技术。提出了该领域未来相关研究的前景,利用了薄膜结构和分子传输特性的相关性。
更新日期:2023-11-27
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