Purpose

The purpose of this paper was prepared a Ni-based superhydrophobic coating on the surface of copper to enhence its corrosion resistance. The superhydrophobic coating (SHPC) has proven to be an effective surface treatment in corrosion protection. In this paper, a Ni-based SHPC was prepared on the surface of copper (Cu) to enhance its corrosion resistance.

Design/methodology/approach

The coating was prepared through a two-step electrodeposition process. The first step involves the formation of a micro-nano structure Ni layer formed by an electrodeposition process. Subsequently, the polysiloxane layer was deposited on the Ni surface to create an SHPC. The morphology, composition, structure, wettability and corrosion resistance of the coating were characterized and discussed.

Findings

The results show that the water contact angle of the as-prepared coating reaches 155.5°±1.0°. The corrosion current density (i_corr = 3.90 × 10⁻⁹ A·cm⁻²) decreased by three orders of magnitude compared to the substrate, whereas |Z|_{f = 0.01 Hz} (2.40 × 10⁶ Ω·cm²) increased by three orders of magnitude. It indicated that the prepared coating has excellent superhydrophobicity and high corrosion resistance, which can provide better protection for the substrate.

Originality/value

The prepared coating provides long-lasting protection for Cu and other metals and offers valuable data for developing SHPCs.

中文翻译：

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两步电沉积铜板超疏水涂层的制备及耐腐蚀性能

目的

本文的目的是在铜表面制备镍基超疏水涂层，以增强其耐腐蚀性能。超疏水涂层（SHPC）已被证明是一种有效的腐蚀防护表面处理方法。本文在铜（Cu）表面制备了镍基SHPC，以增强其耐腐蚀性能。

设计/方法论/途径

该涂层通过两步电沉积工艺制备。第一步是通过电沉积工艺形成微纳结构镍层。随后，将聚硅氧烷层沉积在 Ni 表面上以形成 SHPC。对涂层的形貌、成分、结构、润湿性和耐蚀性进行了表征和讨论。

发现

结果表明，所制备涂层的水接触角达到155.5°±1.0°。与基体相比，腐蚀电流密度（i _corr = 3.90 × 10 ^-9 A·cm ^-2）降低了三个数量级，而|Z| _{f = 0.01  Hz} (2.40 × 10 ⁶ Ω·cm ² ) 增加了三个数量级。表明所制备的涂层具有优异的超疏水性和高耐腐蚀性，能够为基材提供更好的保护。

原创性/价值

制备的涂层为铜和其他金属提供持久的保护，并为开发 SHPC 提供有价值的数据。