In this study, a repeatable and widely applicable method for decreasing the turn-to-turn contact resistivity of REBa₂Cu₃O₇-x (RE=rare earth, REBCO) tapes was demonstrated. By applying a solder without further connections, the contact resistivity can be significantly and consistently decreased to low values. Four solders and five REBCO tapes from various manufacturers were tested to demonstrate the wide applicability of this method. The lowest value achieved by using a combination of solder and surface cleaning procedure was around 3 μΩ cm². Furthermore, a possible governing mechanism for the repeatable decrease method using solder is discussed. The Mikic elastic correlation was considered the most probable candidate. After carefully discussing the three factors of contact resistivity, namely surface roughness, surface conductance, and surface Young's modulus, surface Young's modulus was considered to have a much higher weight index than the surface roughness, and the surface conductance was negligible. This research can help us better understand the contact resistivity of REBCO and develop a method that can controllably adjust the contact resistivity.

在本研究中，展示了一种可重复且广泛适用的降低REBa ₂ Cu ₃ O ₇ -x（RE=稀土，REBCO）带匝间接触电阻率的方法。通过应用焊料而无需进一步连接，接触电阻率可以显着且持续地降低至较低值。对来自不同制造商的四种焊料和五种 REBCO 胶带进行了测试，以证明该方法的广泛适用性。通过使用焊接和表面清洁程序的组合实现的最低值约为3 μΩ cm ²。此外，还讨论了使用焊料的可重复减少方法的可能控制机制。Mikic 弹性相关性被认为是最可能的候选。在仔细讨论了接触电阻率的三个因素，即表面粗糙度、表面电导和表面杨氏模量后，认为表面杨氏模量具有比表面粗糙度高得多的权重指数，而表面电导可以忽略不计。这项研究可以帮助我们更好地了解REBCO的接触电阻率，并开发一种可以可控调节接触电阻率的方法。