Photonic integrated circuits (PICs) have attracted great attention as promising platforms for high-data-rate communications and high-performance computing. For the PICs, photonic devices with compatible materials, compact footprint, high-performance, and sophisticated functionalities are necessary building blocks. Design optimization to implement such devices for target applications and requirements are of critical importance. In this respect, inverse design methods, including iterative optimizations and deep neural networks, have demonstrated significant advantages over the traditional simulation-based trial-and-error optimization approach. We provide an overview of the recent progress on the inverse designs for the integrated photonic devices. The principles and procedure of the inverse design methods are presented and discussed, followed by a summary of the methods employed for specific integrated photonic devices in different integrated photonics material platforms. Finally, topics of future applications and fabrication constraints for the inverse design methods are discussed.

中文翻译：

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集成光子器件逆向设计的最新进展：方法和应用

光子集成电路（PIC）作为高数据速率通信和高性能计算的有前途的平台而引起了极大的关注。对于 PIC 来说，具有兼容材料、紧凑占地面积、高性能和复杂功能的光子器件是必要的构建模块。针对目标应用和要求实施此类设备的设计优化至关重要。在这方面，逆向设计方法，包括迭代优化和深度神经网络，已经表现出比传统的基于仿真的试错优化方法的显着优势。我们概述了集成光子器件逆向设计的最新进展。介绍和讨论了逆向设计方法的原理和过程，然后总结了不同集成光子材料平台中特定集成光子器件所采用的方法。最后，讨论了逆向设计方法的未来应用和制造限制。