In this work, the interface morphology and element distribution of the TC1/AA1060/AA6061 composite plate were studied. The grain information was investigated by electron backscattered diffraction and interface temperature was obtained by numerical simulation to explain the grain information. The experimental samples were tested by mechanical methods. The results show that the TC1/AA1060/AA6061 composite plate has better welding quality by observing interface morphology and testing mechanical properties. The morphology of the two interfaces was consistent with the simulation results, and the interface temperature can be explained by the grain information at interfaces and vortex regions. The diffusion width of elements at the TC1/AA1060 interface was 12.3 µm and no intermetallic compounds were detected; Only Al and O element were detected in two vortex regions. In addition, nanoindentation test was performed at different regions and the results were discussed.

本工作对TC1/AA1060/AA6061复合板的界面形貌和元素分布进行了研究。通过电子背散射衍射研究晶粒信息，并通过数值模拟获得界面温度来解释晶粒信息。实验样品采用机械方法进行测试。通过观察界面形貌和测试力学性能结果表明，TC1/AA1060/AA6061复合板具有较好的焊接质量。两个界面的形貌与模拟结果一致，界面温度可以通过界面和涡流区域的颗粒信息来解释。 TC1/AA1060界面元素扩散宽度为12.3 µm，未检测到金属间化合物；在两个涡流区域仅检测到Al和O元素。此外，在不同区域进行了纳米压痕测试并对结果进行了讨论。