The use of Ni nanopastes for joining applications offers advantages over other methods. However, since it is based on solid-state processes, a pressure must be applied during the joining process, which represents a challenge. To overcome this, a novel concept is presented in this work, which introduces a low-melting additive to the Ni nanopaste. A liquid phase provides the potential to achieve a joint seam formation with both a reduced porosity and better adhesion to the base material without technical pressure during the process. In a comprehensive selection, elements such as Mg, Al, Ge, In, Sn, and Pr are identified as suitable additives. Their properties in binary phase systems with nickel are discussed. A modified Ni nanopaste with Ge as additive was used in promising initial experiments, which is a good starting point for further investigations.

使用镍纳米膏进行连接应用比其他方法具有优势。然而，由于它基于固态工艺，因此在连接过程中必须施加压力，这是一个挑战。为了克服这个问题，这项工作提出了一个新的概念，在镍纳米膏中引入了低熔点添加剂。液相提供了在没有技术压力的情况下实现接缝形成的潜力，同时降低了孔隙率并更好地粘附到基材上。经过综合筛选，确定了Mg、Al、Ge、In、Sn、Pr等元素为合适的添加剂。讨论了它们在含镍的二元相系统中的特性。以 Ge 作为添加剂的改性镍纳米膏用于有希望的初步实验，这是进一步研究的良好起点。