This paper presents layer-by-layer additive manufacturing (AM) of molten metal microdroplets and dielectric materials to fabricate multilayer hybrid circuit boards featuring interdigitated 3D capacitors. The printed metal lines have a low resistance of 5 mΩ/mm, 12 times lower than state-of-the-art conductive inks. Exploiting the advantages of Sn-based oxide as an ideal candidate for Electrical Energy Storage Systems (ESS), we successfully fabricated an out-of-plane capacitor module using a combination of polymer and metal materials. The fabrication process exhibited an exceptional aspect ratio of 16, illustrating the successful incorporation of 20 metal layers in the out-of-plane capacitor module. Q factor obtained for the 3D capacitor was in the range of 66–500. Additionally, a fully automated printing technique was employed to produce a multilayer hybrid electrical printed circuit board (PCB), eliminating the need for post-processing. This streamlined approach presents an efficient and comprehensive solution for the one-stop printing of intricate electrical circuits. © 2024 The Authors. IEEJ Transactions on Electrical and Electronic Engineering published by Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

中文翻译：

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熔融金属微​​滴和聚合物的混合 3D 打印，用于制作具有叉指式 3D 电容器的印刷电路板原型

本文介绍了熔融金属微​​滴和介电材料的逐层增材制造 (AM)，以制造具有叉指型 3D 电容器的多层混合电路板。印刷金属线的电阻低至 5 mΩ/mm，比最先进的导电油墨低 12 倍。利用锡基氧化物作为电能存储系统（ESS）理想候选者的优势，我们成功地使用聚合物和金属材料的组合制造了面外电容器模块。制造工艺呈现出 16 的优异纵横比，说明在面外电容器模块中成功融入了 20 个金属层。 3D 电容器获得的 Q 因子在 66-500 范围内。此外，采用全自动印刷技术生产多层混合电子印刷电路板（PCB），无需后处理。这种简化的方法为复杂电路的一站式打印提供了高效且全面的解决方案。 © 2024 作者。IEEJ Transactions on Electrical and Electronic Engineering由日本电气工程师协会和 Wiley periodicals LLC 出版。