Tungsten (W) stands out as a highly promising plasma-facing materials (PFMs) for future nuclear fusion reactors due to its advantages of excellent high temperature strength, low tritium retention and high recrystallization temperature (RCT). Notably, the potassium-doped tungsten-rhenium (W-Re-K) alloy exhibits exceptional performance when compared to other potential W-based alloys. Nevertheless, even a small amount of Re addition can reduce the thermal conductivity of W, which falls short of the requirement for PFMs. In this study, W-Re-K alloys with Re addition from 0.1 wt% to 0.5 wt% and minor K doping (40 ∼ 50 ppm) were manufactured via powder metallurgy and thermo-mechanical processes. The results revealed that the presence of Re had a grain-refining effect, which became more obvious as its content increased. The incorporation of a small amount of Re (W-0.5 wt% Re-K) exhibited favorable characteristics. Featuring an average grain size of 20.25 µm, and displayed a room temperature thermal conductivity of 163 W/(m⋅K), and an elevated RCT of approximately 1588 °C.

中文翻译：

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少量铼添加对钨合金热性能和再结晶温度的影响

钨（W）因其优异的高温强度、低氚保留和高再结晶温度（RCT）等优点而成为未来核聚变反应堆中极具前景的面向等离子体材料（PFM）。值得注意的是，与其他潜在的钨基合金相比，钾掺杂钨铼 (W-Re-K) 合金表现出优异的性能。然而，即使少量的Re添加也会降低W的热导率，这达不到PFM的要求。在本研究中，通过粉末冶金和热机械工艺制造了 Re 添加量为 0.1 wt% 至 0.5 wt% 和少量 K 掺杂（40 ∼ 50 ppm）的 W-Re-K 合金。结果表明，Re的存在具有细化晶粒的作用，且随着Re含量的增加，晶粒细化作用更加明显。少量Re（W-0.5wt%Re-K）的掺入表现出良好的特性。平均晶粒尺寸为 20.25 µm，室温导热率为 163 W/(m⋅K)，RCT 约为 1588 °C。