This work presents the design, creation, and testing of ultrawideband millimeter-wave (mmWave) antennas with a tightly coupled array (TCA) configuration. These antennas are made using metamaterial (MTM) designs and advanced high-density interconnect (HDI) antenna-in-package (AiP) technologies, ideal for beyond-5G (B5G) and 6G networks. The main elements of the MTM antenna array are constructed with silicon-based integrated passive device (IPD) technology and are flip-chip bonded to a multi-layered HDI-PCB that includes a resistive frequency selective surface (FSS). These array antennas are differentially fed through a coax-via system. The study presents two types of $5\times 5$ finite arrays: a metal-insulator-metal (MIM) capacitor-based MTM bowtie array with a differential Voltage Standing Wave Ratio (VSWR) $\le3.5$ , operating from 16.2 to 100 GHz (excluding 18.26–18.68 GHz and 60.8–61.13 GHz), and an interdigital capacitor-based MTM bowtie array functioning from 18.85 to 100 GHz (excluding 41.52–42.25 GHz). Experimental validation of these prototypes confirms their performance, aligning well with simulated results in terms of bandwidth and radiation characteristics.

中文翻译：

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采用异质集成硅 IPD 和 HDI-PCB 的超材料超宽带毫米波封装天线，适用于 B5G/6G 应用

这项工作介绍了具有紧耦合阵列 (TCA) 配置的超宽带毫米波 (mmWave) 天线的设计、创建和测试。这些天线采用超材料 (MTM) 设计和先进的高密度互连 (HDI) 封装天线 (AiP) 技术制成，非常适合超 5G (B5G) 和 6G 网络。MTM 天线阵列的主要元件采用硅基集成无源器件 (IPD) 技术构建，并通过倒装芯片接合到包含电阻式频率选择表面 (FSS) 的多层 HDI-PCB。这些阵列天线通过同轴电缆系统进行差分馈电。该研究提出了两种类型 $5\乘以5$有限阵列：基于金属-绝缘体-金属 (MIM) 电容器的 MTM 领结阵列，具有差分电压驻波比 (VSWR) $\le3.5$ ，工作频率为 16.2 至 100 GHz（不包括 18.26–18.68 GHz 和 60.8–61.13 GHz），以及基于叉指电容器的 MTM 领结阵列，工作频率为 18.85 至 100 GHz（不包括 41.52–42.25 GHz）。这些原型的实验验证证实了它们的性能，在带宽和辐射特性方面与模拟结果非常吻合。