Distributed acoustic sensing (DAS) technology has been a promising tool in various applications. Currently, the large size and relatively high cost of DAS equipment composed of discrete devices restrict its further popularization to some degree, and the photonic integration technology offers a potential solution. In this paper, we demonstrate an integrated interrogator for DAS on the silicon-on-insulator (SOI) platform. The design of the chip revolves around a Mach–Zehnder modulator (MZM) transmitter and a dual-quadrature and dual-polarization coherent receiver. The integrated interrogator supports multiple DAS schemes, including the time-gated digital optical frequency domain reflectometry (TGD-OFDR), which is adopted for system performance evaluation. 59 pε/√Hz$\sqrt{\mathrm{Hz}}$ strain resolution in 12.1 km sensing fiber with 1.14 m spatial resolution (SR) is realized. Besides, along 49.0 km sensing fiber, 81 pε/√Hz$\sqrt{\mathrm{Hz}}$ strain resolution with 3.78 m SR is achieved. The results show that the integrated interrogator has comparable performance to the discrete DAS system. To the best of our knowledge, this is the first dedicated on-chip DAS interrogator, which validates the effectiveness of the blend of photonics integration and DAS technology.

中文翻译：

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用于光纤分布式声学传感的硅光子集成询问器

分布式声学传感（DAS）技术在各种应用中一直是一种很有前景的工具。目前，由分立器件组成的DAS设备尺寸较大、成本较高，一定程度上限制了其进一步普及，而光子集成技术提供了潜在的解决方案。在本文中，我们展示了绝缘体上硅 (SOI) 平台上用于 ​​DAS 的集成询问器。该芯片的设计围绕马赫-曾德尔调制器 (MZM) 发射器和双正交双偏振相干接收器进行。集成询问器支持多种 DAS 方案，包括用于系统性能评估的时间选通数字光频域反射计 (TGD-OFDR)。59 pε/ √在 12.1 km 传感光纤中实现了Hz$\sqrt{\mathrm{Hz}}$应变分辨率和 1.14 m 空间分辨率 (SR)。此外，沿着49.0 km的传感光纤，81 pε/√$\sqrt{\mathrm{Hz}}$实现了 3.78 m SR 的Hz应变分辨率。结果表明，集成询问器的性能与分立式 DAS 系统相当。据我们所知，这是第一个专用片上 DAS 询问器，它验证了光子集成和 DAS 技术相结合的有效性。