In this paper, the influence of interphase type (i.e. single-phase (PyC) and co-deposited (PyC+SiC)) and thickness (i.e. 300, 600, 1000, and 2000 nm) on the interface properties and damage evolution of mini-C/SiC composites under cyclic loading/unloading tension was investigated. The micromechanical constitutive model was adopted to derive the damage parameter of inverse tangent modulus (ITM) and perform the hysteresis analysis to estimate the interface properties of the mini-C/SiC composites with large debonding energy. Experimental damage evolution of the ITMs with unloading or reloading stress was analyzed for different interphase types and thickness. The interface properties (e.g. the interface debonding stress and interface debonding energy) were obtained through the hysteresis analysis. Relationships between the loading/unloading ITMs, interface properties, and interphase type and thickness were established.

中文翻译：

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界面类型和厚度对C/SiC复合材料界面性能和拉伸损伤演化的影响

本文研究了界面类型（即单相（PyC）和共沉积（PyC+SiC））和厚度（即300、600、1000和2000 nm）对微型纳米材料界面性质和损伤演化的影响。研究了循环加载/卸载张力下的-C/SiC 复合材料。采用微观力学本构模型推导了反正切模量（ITM）的损伤参数，并进行滞后分析来估计大脱粘能的mini-C/SiC复合材料的界面性能。针对不同的界面类型和厚度，分析了 ITM 在卸载或重新加载应力下的实验损伤演化。通过磁滞分析获得了界面特性（例如界面脱粘应力和界面脱粘能）。建立了加载/卸载 ITM、界面特性以及界面类型和厚度之间的关系。