This paper reports a novel additive manufacturing technique for MEMS devices using newly developed APSLD (atmospheric pressure sputtering layer deposition) technology. It uses a microplasma at atmospheric pressure to deposit microstructures with defined properties, such as conducting or isolating directly at different surfaces additively without complex and time-consuming manufacturing routes like planar technology. Feasibility tests have been successfully done to deposit metal lines, isolating and metal oxide layers on 3D surfaces to manufacture high stable MEMS sensor system for harsh environments. This is a promising technology in the field of MEMS manufacturing, as it can simplify the manufacturing process and reduce the cost. The ability to deposit different materials can expand the design possibilities for MEMS devices. © 2024 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

中文翻译：

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使用 APSLD（大气压溅射层沉积）技术的基于等离子体的 MEMS 增材制造方法†

本文报道了一种使用新开发的 APSLD（大气压溅射层沉积）技术的 MEMS 器件新型增材制造技术。它使用大气压下的微等离子体来沉积具有确定特性的微结构，例如直接在不同表面上以附加方式传导或隔离，而无需像平面技术那样复杂且耗时的制造路线。已成功完成在 3D 表面上沉积金属线、隔离层和金属氧化物层的可行性测试，以制造适用于恶劣环境的高稳定性 MEMS 传感器系统。这是MEMS制造领域一项很有前途的技术，因为它可以简化制造工艺并降低成本。沉积不同材料的能力可以扩展 MEMS 器件的设计可能性。 © 2024 日本电气工程师协会和 Wiley periodicals LLC。