当前位置: X-MOL 学术Eng. Anal. Bound. Elem. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
A batch-filling method of VIE-MoM matrix for inhomogeneous dielectric target with full- and half-SWG function
Engineering Analysis With Boundary Elements ( IF 3.3 ) Pub Date : 2024-03-07 , DOI: 10.1016/j.enganabound.2024.03.012
Ruqi Xiao , Wen Geyi , Guo Yang , Wen Wu

A batch-filling method (BFM) for generating the volume-integral-equation-methods of moment (VIE-MoM) matrix for the scattering of inhomogeneous objects by using the full- and half-SWG basis function is proposed. The BFM is based on the summation of contributions of all integrals over tetrahedrons and boundary faces, and the contributions are arranged into a column vector that represents the interactions of the source basis function with all the test basis functions. The time of the BFM for filling VIE-MoM matrix can be reduced over 95% compared with the conventional basis-basis (CBB) matching filling scheme due to the vector filling scheme, which avoids the repeated traversal between the source tetrahedron and test tetrahedron to fill the impedance matrix elements. Details for the numerical process and the filling scheme of impedance matrix are elaborated. Numerical results show that the batch-filling method has high computational efficiency and accuracy for VIE-MoM.

中文翻译:

具有全SWG和半SWG功能的非均匀介电靶材VIE-MoM矩阵批量填充方法

提出了一种使用全SWG和半SWG基函数生成非均匀物体散射的体积积分方程方法(VIE-MoM)矩阵的批量填充方法(BFM)。BFM 基于四面体和边界面上所有积分的贡献之和,并将贡献排列成列向量,该列向量表示源基函数与所有测试基函数的相互作用。由于采用矢量填充方案,BFM填充VIE-MoM矩阵的时间比传统的基-基(CBB)匹配填充方案减少95%以上,避免了源四面体和测试四面体之间的重复遍历,填充阻抗矩阵元素。详细阐述了阻抗矩阵的数值处理和填充方案。数值结果表明,批量填充方法对于VIE-MoM具有较高的计算效率和精度。
更新日期:2024-03-07
down
wechat
bug