Organic polymer materials with low dielectric properties have garnered significant attention due to their convenient preparation process, low cost, and commendable mechanical properties. Such polymers, especially with heteromorphic structures, exhibited great potential for future electronic devices and antennas, particularly accompanied with rapid manufacturing technologies like three-dimensional (3D) printing. In this study, a series of new allyl ether-ended hyperbranched fluorene-based polyaryletherketone (-PFAEK-Allyls) were developed. The content of allyl ether photosensitive groups and molecular weight were controlled by adjusting the molar ratio of OH:F loading. UV-curable resins were then prepared through blending between -PFAEK-Allyls with trimethylolpropane triacrylate (TMPTA) and ethylene glycol bis(3-mercaptopropionate) (EGBMP), resulting in thiol-allyl-acrylate ternary UV-cured system. The influence of molecular weight of the hyperbranched polymers on the thermal performance, mechanical properties, and dielectric properties of the UV-cured films was systematically investigated. The results show that due to the introduction of hyperbranched structure with high molecular weight, the T of the UV-cured film can reach up to 248 °C. Due to the increased molecular free volume in the hyperbranched structure, the dielectric constant of the UV-cured film can be reduced to as low as 2.74 at 1 GHz. Due to the design of thiol-allyl-acrylate ternary UV-cured system, the cured film has excellent mechanical properties, with the highest tensile strength of 61.0 MPa and the elongation at break of 7.0%. This study represents innovative progress on integrating fully aromatic-based photosensitive hyperbranched polyaryletherketone into UV-curable resin architecture. Overall, the herein -PFAEK-Allyls-based photosensitive resins exhibit outstanding comprehensive performance and holds great potential for application in advanced 3D printing technology.

中文翻译：

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坚韧的超支化聚芳醚酮基光敏树脂，具有优异的介电性能和耐热性

低介电性能有机聚合物材料因其制备工艺简便、成本低廉和良好的机械性能而受到广泛关注。此类聚合物，尤其是具有异形结构的聚合物，在未来电子设备和天线方面展现出巨大的潜力，特别是与三维（3D）打印等快速制造技术相结合。在这项研究中，开发了一系列新型烯丙基醚封端的超支化芴基聚芳醚酮（-PFEAK-Allyls）。通过调节OH:F负载量的摩尔比来控制烯丙基醚光敏基团的含量和分子量。然后通过将-PFEAK-烯丙基与三羟甲基丙烷三丙烯酸酯(TMPTA)和乙二醇双(3-巯基丙酸酯)(EGBMP)共混来制备UV固化树脂，形成硫醇-烯丙基-丙烯酸酯三元UV固化体系。系统研究了超支化聚合物的分子量对紫外光固化薄膜的热性能、机械性能和介电性能的影响。结果表明，由于高分子量超支化结构的引入，UV固化膜的T高达248℃。由于超支化结构中分子自由体积的增加，UV固化薄膜的介电常数在1GHz下可降至低至2.74。由于硫醇-烯丙酯-丙烯酸酯三元UV固化体系的设计，固化膜具有优异的机械性能，最高拉伸强度为61.0 MPa，断裂伸长率为7.0%。这项研究代表了将全芳香基光敏超支化聚芳醚酮集成到紫外光固化树脂结构中的创新进展。总体而言，本文的-PFAEK-烯丙基类光敏树脂表现出优异的综合性能，在先进3D打印技术中具有巨大的应用潜力。