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Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-20 , DOI: 10.1109/tcpmt.2024.3379219 Adlil Aizat Ismail 1 , Maria Abu Bakar 2 , Azman Jalar 3 , Zol Effendi Zolkefli 1 , Erwan Basiron 1 , Muhammad Nizam Ilias 1
中文翻译：
用于高效无铅焊点球栅阵列 (BGA) 元件返修的激光返修工艺
更新日期：2024-03-20
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-20 , DOI: 10.1109/tcpmt.2024.3379219 Adlil Aizat Ismail 1 , Maria Abu Bakar 2 , Azman Jalar 3 , Zol Effendi Zolkefli 1 , Erwan Basiron 1 , Muhammad Nizam Ilias 1
Affiliation
中文翻译：
用于高效无铅焊点球栅阵列 (BGA) 元件返修的激光返修工艺
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