To investigate the impact of Twinning Boundary Spacing (TBS) on the mechanical characteristics and deformation behavior of nanotwinned Cu–Ag alloys with solute gradient segregation structure during nanoindentation, Voronoi’s method is utilized to create a nanotwinned Cu–Ag alloy model with solute gradient segregation structure. Then, the indentation process of the indenter pressed into the model with varying TBS is simulated using the Molecular Dynamics (MD) simulation, yielding depth-stress curves of the corresponding indenter. According to the findings, yield stresses are lower in Cu–Ag alloys with smaller twin spacing. Grain boundary activities play a governing role in the plastic deformation of the matrix during the small deformation stage, although dislocations also play a part. Grain boundaries have less of an impact on material deformation during the big deformation stage, and dislocations are primarily responsible for the matrix’s plastic deformation. The stacking faults and deformation twin are more prone to occur inside grains with higher solute-atom concentrations compared to grain boundaries with lower solute-atom concentrations.

为了研究纳米压痕过程中孪晶边界间距（TBS）对具有溶质梯度偏析结构的纳米孪晶Cu-Ag合金的力学特性和变形行为的影响，利用Voronoi方法创建了具有溶质梯度偏析结构的纳米孪晶Cu-Ag合金模型。然后，使用分子动力学（MD）模拟压头压入具有不同TBS的模型的压痕过程，产生相应压头的深度-应力曲线。根据研究结果，孪晶间距较小的铜银合金的屈服应力较低。尽管位错也发挥了一定作用，但晶界活动在小变形阶段的基体塑性变形中起主导作用。在大变形阶段，晶界对材料变形的影响较小，位错是基体塑性变形的主要原因。与溶质原子浓度较低的晶界相比，堆垛层错和变形孪晶更容易发生在溶质原子浓度较高的晶粒内部。