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Simulation calculation and experimental study on the properties of Re, In, and Nb-doped Ag/Ni electrical contact materials
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-25 , DOI: 10.1109/tcpmt.2024.3380061 Jingqin Wang 1 , Menghan Wang 1 , Yixuan Zhang 1
中文翻译：
Re、In、Nb掺杂Ag/Ni电接触材料性能模拟计算与实验研究
更新日期：2024-03-25
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-25 , DOI: 10.1109/tcpmt.2024.3380061 Jingqin Wang 1 , Menghan Wang 1 , Yixuan Zhang 1
Affiliation
中文翻译：
Re、In、Nb掺杂Ag/Ni电接触材料性能模拟计算与实验研究
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