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Formation of Wavy Crack in Double Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-26 , DOI: 10.1109/tcpmt.2024.3382131 Daisuke Yasugi 1 , Keisuke Wakamoto 1 , Yuga Kumakiri 1 , Takahiro Namazu 2
中文翻译：
经受热冲击测试的双层 Ag 和 CuO/Ag 烧结芯片连接组件中波状裂纹的形成
更新日期：2024-03-26
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-26 , DOI: 10.1109/tcpmt.2024.3382131 Daisuke Yasugi 1 , Keisuke Wakamoto 1 , Yuga Kumakiri 1 , Takahiro Namazu 2
Affiliation
中文翻译：
经受热冲击测试的双层 Ag 和 CuO/Ag 烧结芯片连接组件中波状裂纹的形成
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