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Impacts of the Pressure Distribution on Dynamic Avalanche in Single Press-Pack IGBT Chip
IEEE Transactions on Power Electronics ( IF 6.7 ) Pub Date : 2024-03-26 , DOI: 10.1109/tpel.2024.3381921 Tianchen Li 1 , Yaohua Wang 2 , Yiming Zhang 3 , Jiayu Fan 1 , Xuebao Li 1 , Lei Qi 1 , Xiang Cui 1
中文翻译：
压力分布对单压装 IGBT 芯片动态雪崩的影响
更新日期：2024-03-26
IEEE Transactions on Power Electronics ( IF 6.7 ) Pub Date : 2024-03-26 , DOI: 10.1109/tpel.2024.3381921 Tianchen Li 1 , Yaohua Wang 2 , Yiming Zhang 3 , Jiayu Fan 1 , Xuebao Li 1 , Lei Qi 1 , Xiang Cui 1
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中文翻译：
压力分布对单压装 IGBT 芯片动态雪崩的影响
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