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High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress-Strength Interference Modeling
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-26 , DOI: 10.1109/tcpmt.2024.3382153 Tao Zhang , Xiaopeng Wu , Guangbao Shan , Yikang Wang , Jiahao Hou , Yintang Yang
中文翻译:
基于应力强度干涉模型的封装器件高过载故障率预测方法
更新日期:2024-03-26
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-26 , DOI: 10.1109/tcpmt.2024.3382153 Tao Zhang , Xiaopeng Wu , Guangbao Shan , Yikang Wang , Jiahao Hou , Yintang Yang
中文翻译:
基于应力强度干涉模型的封装器件高过载故障率预测方法