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Construction of fluorinated hyperbranched polyaryletherketone-based UV-cured films with low dielectric and enhanced mechanical properties
Polymer ( IF 4.6 ) Pub Date : 2024-03-22 , DOI: 10.1016/j.polymer.2024.126902
Lingmei Jiang , Haoran Liu , Kuanyu Yuan , Guangsheng Zhang , Changhong Xiao , Chenghao Wang , Lishuai Zong , Jinyan Wang , Xigao Jian

The incorporation of hyperbranched structure into the polyaryletherketone (PAEK) is a crucial method for achieving a low dielectric constant (), and the inclusion of crosslinked structure effectively reduces the dielectric loss (). This approach is of great significance in the development of high-quality communication at high frequencies. However, it is still a significant challenge for maintaining its mechanical properties and reducing and due to the poor film-forming properties and low ductility of hyperbranched polymers. In this study, we synthesized a novel acrylate-based fluorinated hyperbranched photosensitive polyaryletherketone (-P6FAEK-Ace) as a prepolymer with various bifunctional aliphatic active and 4-acryloyl morpholine as the reactive solvent. Upon UV irradiation, cured films were obtained. This method significantly improved the mechanical properties of the hyperbranched UV-cured resin, with the tensile strength of CF-DCDDA of 83.2 MPa and the elongation at break of 7.61%. Additionally, the five prepared photosensitive resins exhibited excellent rheological properties (from 71.6 mPa s to 134.7 mPa s at 100 °C), rapid curing rates (within tens of seconds), and minimal volume shrinkage (<7%). Meanwhile, the of CF-DCDDA was measured to be 2.87, with a of 0.0126 at the frequency of 20 GHz. This low dielectric expression for the crosslinked cured films could be ascribed to the confinement of electronic polarization caused by the crosslinked and hyperbranched structures. This work provides a simple, green, and promising strategy for enhancing the dielectric and mechanical properties of -PAEK.

中文翻译:

具有低介电常数和增强机械性能的氟化超支化聚芳醚酮基紫外固化薄膜的构建

在聚芳醚酮(PAEK)中引入超支化结构是实现低介电常数()的关键方法,而交联结构的引入有效降低了介电损耗()。这种方法对于发展高频高质量通信具有重要意义。然而,由于超支化聚合物的成膜性能差和延展性低,保持其机械性能和降低仍是一个重大挑战。在这项研究中,我们合成了一种新型丙烯酸酯基氟化超支化光敏聚芳醚酮(-P6FAEK-Ace)作为预聚物,以各种双官能脂肪族活性物质和4-丙烯酰吗啉作为反应溶剂。在UV照射下,获得固化膜。该方法显着提高了超支化紫外光固化树脂的力学性能,CF-DCDDA的拉伸强度为83.2 MPa,断裂伸长率为7.61%。此外,制备的五种光敏树脂表现出优异的流变性能(100℃下从71.6 mPa s到134.7 mPa s)、快速固化速率(数十秒内)和最小的体积收缩(<7%)。同时,测量CF-DCDDA的α为2.87,在20GHz频率下α为0.0126。交联固化膜的这种低介电表现可归因于交联和超支化结构引起的电子极化的限制。这项工作为增强-PAEK的介电和机械性能提供了一种简单、绿色且有前景的策略。
更新日期:2024-03-22
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