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Liquid Metal Fluidic Connection and Floating Die Structure for Ultra Low Thermomechanical Stress of SiC Power Electronics Packaging
IEEE Transactions on Power Electronics ( IF 6.7 ) Pub Date : 2024-03-27 , DOI: 10.1109/tpel.2024.3379121 Wei Mu , Ameer Janabi , Borong Hu , Luke Shillaber , Teng Long
中文翻译:
用于碳化硅电力电子封装超低热机械应力的液态金属流体连接和浮动模具结构
更新日期:2024-03-27
IEEE Transactions on Power Electronics ( IF 6.7 ) Pub Date : 2024-03-27 , DOI: 10.1109/tpel.2024.3379121 Wei Mu , Ameer Janabi , Borong Hu , Luke Shillaber , Teng Long
中文翻译:
用于碳化硅电力电子封装超低热机械应力的液态金属流体连接和浮动模具结构