The PANDA (antiProton ANnihilation at DArmstadt) experiment will study the strong interaction in annihilation reactions between an antiproton beam and a stationary cluster jet target. The PANDA detector will be composed of several sub-detectors designed for tracking, particle identification and calorimetry. The Micro-Vertex Detector (MVD) is the innermost part of the tracking system surrounding the interaction region, which is designed for precise vertex and tracking detection. It consists of silicon pixel and double-sided microstrip detectors. For the readout of the microstrip sensors an ASIC called ToASt (Torino Asic for Strip readout) is being developed in 0.11 μm CMOS technology at INFN Turin. The ASIC takes advantage of both Time-over-Threshold and Time-of-Arrival methods to accurately measure the event's energy and timestamp. To sustain the acquisition of the microstrip sensors a MDC (Module Data Concentrator) ASIC is under development at KIT. Up to eight ToASt front-ends' data streams are multiplexed, read out and processed by one MDC. The data of several MDCs are collected and processed by the off-detector readout card MMB (MVD Multiplexer Board), also under development at KIT. The processed data is then transferred via 100 GbE optical links to the computing nodes. The ToASt chips have been integrated with the FPGA implementation of the MDC to form the first fully functional detector module. Beam tests have been performed at the COSY facility in Jülich. This paper focuses on the design of MDC ASIC and MMB board, the integration with the ToASt and presents preliminary beam test results.

中文翻译：

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PANDA微顶点探测器数据采集系统

PANDA（达姆施塔特的反质子湮灭）实验将研究反质子束和静止簇射流目标之间湮灭反应中的强相互作用。 PANDA探测器将由几个设计用于跟踪、粒子识别和量热测定的子探测器组成。微顶点检测器（MVD）是围绕交互区域的跟踪系统的最内部部分，专为精确的顶点和跟踪检测而设计。它由硅像素和双面微带探测器组成。为了实现微带传感器的读出，INFN 都灵正在采用 0.11 μm CMOS 技术开发一种名为 ToASt（Torino Asic for Strip readout）的 ASIC。 ASIC 利用阈值时间和到达时间方法来准确测量事件的能量和时间戳。为了维持微带传感器的采集，KIT 正在开发 MDC（模块数据集中器）ASIC。一台 MDC 可以复用、读取和处理多达 8 个 ToASt 前端的数据流。多个 MDC 的数据由离检测器读出卡 MMB（MVD 多路复用器板）收集和处理，该卡也在 KIT 开发中。然后，处理后的数据通过 100 GbE 光链路传输到计算节点。 ToASt 芯片已与 MDC 的 FPGA 实现集成，形成第一个全功能检测器模块。光束测试已在于利希的 COSY 工厂进行。本文重点介绍 MDC ASIC 和 MMB 板的设计、与 ToASt 的集成，并提供初步的波束测试结果。