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Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned Films
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-28 , DOI: 10.1109/tcpmt.2024.3380621 Tung-Han Chuang, Yen-Ting Chen, Yin-Hsuan Chen, Chia-Ching Chu, Chao-Sung Lin
中文翻译:
通过高密度 (111) 取向银纳米孪晶薄膜背面金属化改进 SiC/DBC 功率模块的银烧结芯片接合
更新日期:2024-03-28
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-03-28 , DOI: 10.1109/tcpmt.2024.3380621 Tung-Han Chuang, Yen-Ting Chen, Yin-Hsuan Chen, Chia-Ching Chu, Chao-Sung Lin
中文翻译:
通过高密度 (111) 取向银纳米孪晶薄膜背面金属化改进 SiC/DBC 功率模块的银烧结芯片接合