当前位置:
X-MOL 学术
›
IEEE Trans. Comput.-Aided Design Integr. Circuits Syst.
›
论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
On Legalization of Die Bonding Bumps and Pads for 3D ICs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ( IF 2.9 ) Pub Date : 2024-03-28 , DOI: 10.1109/tcad.2024.3382835 Yen-Hsiang Huang , Sai Pentapati , Anthony Agnesina , Moritz Brunion , Sung Kyu Lim
中文翻译:
3D IC 芯片接合凸点和焊盘的合法化
更新日期:2024-03-28
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ( IF 2.9 ) Pub Date : 2024-03-28 , DOI: 10.1109/tcad.2024.3382835 Yen-Hsiang Huang , Sai Pentapati , Anthony Agnesina , Moritz Brunion , Sung Kyu Lim
中文翻译:
3D IC 芯片接合凸点和焊盘的合法化