This study aimed to evaluate the mechanical characteristics and application of e-waste as a filler for glass fiber composites made of S and E (e-waste + S E). Metal, printed circuit boards, integrated circuits, diodes, and transistors were separated from the e-waste filler during milling. S and E glass fiber, epoxy, and filler were utilized in proportions of 10%, 10%, and 70%, respectively, on a volume basis. The hand lay-up technique was used to construct composite specimens. Scanning electron microscope analysis was used to gauge how filler loading affected the morphology of composite materials. The composite has a compressive strength of 23.760 MPa, which is 69.71% higher than the Geo poly composite. The tensile strength of this composite is withstood up to 16.078 MPa. It has 53% better tensile properties than Sunflower Husk composites with the same operating conditions. It gives a resistance up to 42 D during hardness test to withstand. It was 15.6% better than the NF30% epoxy composite specimen. The e-waste + S E composite gives a great opposite force of up to 2 kJ on the impact load test.; it was 86.9% higher than fly ash epoxy composites.

中文翻译：

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双玻纤电子垃圾复合材料力学性能实验分析

本研究旨在评估电子垃圾作为 S 和 E 玻璃纤维复合材料（电子垃圾 + SE）填料的机械特性和应用。在研磨过程中，金属、印刷电路板、集成电路、二极管和晶体管与电子垃圾填充物分离。 S 和 E 玻璃纤维、环氧树脂和填料的使用比例分别为 10%、10% 和 70%（基于体积）。手糊技术用于构造复合材料样本。扫描电子显微镜分析用于测量填料负载量如何影响复合材料的形态。该复合材料的抗压强度为23.760 MPa，比Geo Poly复合材料高69.71%。该复合材料的抗拉强度高达 16.078 MPa。在相同操作条件下，其拉伸性能比向日葵壳复合材料高出 53%。在硬度测试过程中，它的抵抗力高达 42 D。比 NF30% 环氧复合材料试件好 15.6%。电子垃圾+SE复合材料在冲击载荷测试中产生高达2kJ的巨大反作用力。比粉煤灰环氧复合材料高86.9%。