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The Temperature Cycling Characteristic of Copper Pillar Solder Joints
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-04-08 , DOI: 10.1109/tcpmt.2024.3385401 Yong Wang 1 , Shifeng Yu 2 , Junhui Li 2
中文翻译：
铜柱焊点的温度循环特性
更新日期：2024-04-08
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-04-08 , DOI: 10.1109/tcpmt.2024.3385401 Yong Wang 1 , Shifeng Yu 2 , Junhui Li 2
Affiliation
中文翻译：
铜柱焊点的温度循环特性
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