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Rational Design of Different Ga Content Bilayer InGaZnO Thin-Film Transistors With Al₂O₃/HfO₂ Passivation Layer
IEEE Transactions on Electron Devices ( IF 3.1 ) Pub Date : 2024-04-08 , DOI: 10.1109/ted.2024.3383429 Patigul Nurmamat 1 , Ablat Abliz 1
IEEE Transactions on Electron Devices ( IF 3.1 ) Pub Date : 2024-04-08 , DOI: 10.1109/ted.2024.3383429 Patigul Nurmamat 1 , Ablat Abliz 1
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This study investigated the effects of different Ga contents on the performance of single amorphous InGaZnO (a-IGZO) and bilayer InGa(0.5%)ZnO/InGa(1%)ZnO thin-film transistors (TFTs). Through rational design, a bilayer TFT exhibiting the best performance, including a ${V}_{\text {th}}$ of 1.2 V, ${I}_{\text {on}}/{I}_{\text {off}}$ of $1\times 10^{{8}}$
, SS of 0.28 V/decade, and $\mu _{\text {FE}}$ of 32.5 cm2/Vs, was obtained. This improved performance was attributed to the InGa(0.5%)ZnO front layer enhancing the $\mu _{\text {FE}}$ with low surface defect and high ${N}_{\text {e}}$ and the InGa(1%)ZnO back layer controlling the ${V}_{\text {th}}$ with low ${V}_{\text {O}}$ and ${N}_{\text {e}}$ in the bilayer device. Owing to the formation of energy band bending, the electrons transferred from the InGa(0.5%)ZnO to InGa(1%)ZnO layer. This resulted in the accumulation of free electrons near the interface, thereby enhancing the $\mu _{\text {FE}}$ of the bilayer device. Moreover, a minor shift in the ${V}_{\text {th}}$ (0.4 and −0.5 V) of InGa(0.5%)ZnO/InGa(1%)ZnO TFTs with HfO2/Al2O3 dual passivation layer (PVL) was observed under positive and negative gate bias light illumination stress with relative humidity 60% condition. This was attributed to the HfO2/Al2O3 PVL protecting the channel from oxygen adsorption/desorption and environmental influences. Thus, the designed bilayer InGa(0.5%)ZnO/InGa(1%)ZnO TFTs with HfO2/Al2O3 PVL have enabled new pathways for achieving high-performance and highly stable oxide TFTs.
中文翻译:
不同Ga含量Al2O3/HfO2钝化层双层InGaZnO薄膜晶体管的合理设计
本研究研究了不同Ga含量对单层非晶InGaZnO (a-IGZO)和双层InGa(0.5%)ZnO/InGa(1%)ZnO薄膜晶体管(TFT)性能的影响。通过合理的设计,双层TFT表现出了最佳的性能,包括 ${V}_{\text {th}}$ 1.2V, ${I}_{\text {开}}/{I}_{\text {关}}$ 的 $1\乘以10^{{8}}$
,SS 为 0.28 V/十倍频程,并且 $\mu _{\text {FE}}$ 获得 32.5 cm2/Vs。这种性能的提高归因于 InGa(0.5%)ZnO 前层增强了 $\mu _{\text {FE}}$ 具有低表面缺陷和高 ${N}_{\text {e}}$ 和InGa(1%)ZnO背层控制 ${V}_{\text {th}}$ 与低 ${V}_{\文本{O}}$ 和 ${N}_{\text {e}}$ 在双层器件中。由于能带弯曲的形成,电子从InGa(0.5%)ZnO层转移到InGa(1%)ZnO层。这导致界面附近自由电子的积累,从而增强了 $\mu _{\text {FE}}$ 双层装置。此外,一个微小的转变 ${V}_{\text {th}}$ 在相对湿度 60% 条件下,在正负栅极偏压光照应力下观察具有 HfO2/Al2O3 双钝化层 (PVL) 的 InGa(0.5%)ZnO/InGa(1%)ZnO TFT(0.4 和 -0.5 V)。这归因于 HfO2/Al2O3 PVL 保护通道免受氧气吸附/解吸和环境影响。因此,设计的具有HfO2/Al2O3 PVL的双层InGa(0.5%)ZnO/InGa(1%)ZnO TFT为实现高性能和高稳定性氧化物TFT提供了新途径。
更新日期:2024-04-08
中文翻译:
不同Ga含量Al2O3/HfO2钝化层双层InGaZnO薄膜晶体管的合理设计
本研究研究了不同Ga含量对单层非晶InGaZnO (a-IGZO)和双层InGa(0.5%)ZnO/InGa(1%)ZnO薄膜晶体管(TFT)性能的影响。通过合理的设计,双层TFT表现出了最佳的性能,包括