Abstract

The impinging jet technique is a high-performance cooling technology for microchips which are basic elements of electronic systems and having high heat generation rates in small volumes. In this study, the improvement of heat transfer of the microchips used in all technological products today by air impinging jet has been examined. For this purpose, numerical research has been carried out on the cooling of copper plate surfaces with two different patterns, reverse triangle and reverse semi-circle shaped having 1000 W/m² constant heat flux in rectangular cross-section ducts with adiabatic surfaces, by one and double air jets with distances of D\(_{h}\) and 2D\(_{h}\) between them. Numerical computation has been performed for energy and Navier–Stokes equations as steady and three-dimensional by employing the Ansys-Fluent computer program with the k-\(\varepsilon\) turbulence model. The obtained results have been compared with the numerical and experimental results of the study in the literature and it has been seen that they are compatible with each other. The results have been presented as the mean Nu number and the variation of surface temperature for each of both patterned surfaces in single and double jet channels with different distances. Streamline and temperature contour distributions of the jet flow along the channel for different H/D\(_{h}\) ratios and jet numbers have been evaluated for both patterned surfaces. In double-jet and 2D\(_{h}\) distance channels compared to D\(_{h}\), at H/D\(_{h}\) = 12 and Re = 11,000, the Nu number increases of 67% and 65.9% have been observed on the first-row reverse triangle and semi-circular patterned surfaces, respectively.

中文翻译：

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不同空气射流冲击应用对电子系统表面​​传热增量的研究

摘要

冲击喷射技术是一种用于微芯片的高性能冷却技术，微芯片是电子系统的基本元件，并且在小体积下具有高发热率。在这项研究中，研究了当今所有技术产品中使用的微芯片通过空气冲击射流改善传热的情况。为此，对具有1000 W/m ²恒定热通量的倒三角形和倒半圆形两种不同图案的铜板表面 在绝热表面矩形截面管道中的冷却进行了数值研究，一个和两个空气喷嘴， 它们之间的距离为 D \(_{h}\) 和 2D \(_{h}\) 。通过使用 Ansys-Fluent 计算机程序和 k- \(\varepsilon\)湍流模型，对能量方程和纳维-斯托克斯方程进行了稳定的三维数值计算 。将所得结果与文献中研究的数值和实验结果进行了比较，发现它们是相互兼容的。结果表示为不同距离的单喷射通道和双喷射通道中每个图案表面的平均 Nu 数和表面温度的变化。 已针对两个图案表面评估了不同 H/D \(_{h}\)比率和射流数量的射流沿通道的流线和温度等值线分布。在双射流和 2D \(_{h}\) 距离通道中，与 D \(_{h}\)相比，在 H/D \(_{h}\)  = 12 且 Re = 11,000 时，Nu 数在第一行倒三角形和半圆形图案表面上分别观察到增加了 67% 和 65.9%。