当前位置:
X-MOL 学术
›
IEEE Trans. Compon. Packag. Manuf. Technol.
›
论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Multi-physics effect of temperature and humidity on copper wire bond degradation via enthalpy-based water-vapour energy
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-04-10 , DOI: 10.1109/tcpmt.2024.3386877 Michael Joo Zhong Lim , Hai Guan Loh , Michael Goroll , Zhong Chen , Chuan Seng Tan
中文翻译:
基于热函的水蒸气能量,温度和湿度对铜线键合退化的多物理效应
更新日期:2024-04-10
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-04-10 , DOI: 10.1109/tcpmt.2024.3386877 Michael Joo Zhong Lim , Hai Guan Loh , Michael Goroll , Zhong Chen , Chuan Seng Tan
中文翻译:
基于热函的水蒸气能量,温度和湿度对铜线键合退化的多物理效应