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Experimental Study on Crack Propagation of Adhesive Layer within Mini-LED Chips Needle-ejecting Peeling-off Transfer Mode
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-04-10 , DOI: 10.1109/tcpmt.2024.3386744 Li Ma 1 , Yanhui Chen 1 , Yun Chen 1 , Wanqun Chen 2 , Xin Chen 1 , Maoxiang Hou 1 , Ching-Ping Wong 3 , Yan Niu 4 , Minghui Yao 4
中文翻译：
Mini-LED芯片内胶层裂纹扩展针射剥离转移模式实验研究
更新日期：2024-04-10
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2024-04-10 , DOI: 10.1109/tcpmt.2024.3386744 Li Ma 1 , Yanhui Chen 1 , Yun Chen 1 , Wanqun Chen 2 , Xin Chen 1 , Maoxiang Hou 1 , Ching-Ping Wong 3 , Yan Niu 4 , Minghui Yao 4
Affiliation
中文翻译：
Mini-LED芯片内胶层裂纹扩展针射剥离转移模式实验研究
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