Purpose

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

Design/methodology/approach

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

Findings

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

Originality/value

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

中文翻译：

---

简化倒装微元件四点弯曲测试的有限元分析

目的

本研究的目的是提出一种简化可靠性测试建模的方法。对印刷电路板 (PCB)/微电子元件组件的可靠性测试进行建模需要采用几个简化的假设。本研究介绍并验证了在 PCB/晶圆级芯片级封装组件上进行四点弯曲测试建模的简化假设。

设计/方法论/途径

在本研究中，使用了简化假设。这些涉及用等效静态载荷代替动态施加位移载荷，用简化形状（圆柱形和立方体）代替互连的球形形状，以及从三维建模方法过渡到等效二维模型。通过对所获得的数值结果进行定量和定性比较，证实了这些简化的有效性。焊球和铜焊盘的最大主塑性应变作为比较标准。

发现

通过对各种模型的结果进行定量和定性比较来验证简化的假设。因此，确定用等效静载荷代替动载荷对结果没有显着影响。类似地，用等效形状代替互连的球形形状以及从三维方法过渡到二维方法并没有显着影响所获得结果的精度。

原创性/价值

这项研究为寻求模拟加速可靠性测试的研究人员提供了宝贵的资源，特别是在四点弯曲测试的背景下。本研究获得的结果将帮助其他研究人员简化其数值模型，从而通过利用本文介绍和验证的简化假设来降低计算成本。