Residual stress in multilayer coatings is a complex phenomenon influenced by layer number and thickness, layer and substrate materials, deposition technique, process parameters, and working pressure. It is crucial to realize these stresses because they have a significant impact on the performance and reliability of multilayer structures in their applications. The measurement of the residual stress on multilayer thin films locally and globally is crucial. This study employed ring-core milling residual stress measurement on the High-Power Impulse Magnetron Sputtering (HiPIMS) fabricated Tungsten/Copper (W/Cu) Chromium/Copper (Cr/Cu) multilayer thin films. The displacement transformation strain was analyzed using Focused Ion Beam (FIB) ring-core milling combined with Digital Image Correlation (DIC), and the strain stress transformation calibration coefficients were analyzed through Finite Element Method (FEM) to investigate the residual stress of the thin films layer by layer. The study results indicated that the hard thin films (W, Cr) were the main source of residual stress in the multilayer thin film structure, while the soft thin film (Cu) had a lower residual stress. Having Cu as the intermediate layer was found to be effective for controlling the residual stress of thin films. The hard thin films encapsulated by the soft thin films had smaller stress values than those with hard films on the surface. In addition, the study observes the stress gradient and distribution at different depths and locations on the sample to reveal process parameters to balance between the soft and hard thin films and could help to predict the location of the damage on the multilayer thin films caused by higher stress.

中文翻译：

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HiPIMS W/Cu 和 Cr/Cu 多层薄膜残余应力的 FIB-DIC 环芯测量

多层涂层中的残余应力是一种复杂的现象，受层数和厚度、层和基材材料、沉积技术、工艺参数和工作压力的影响。认识这些应力至关重要，因为它们对多层结构在应用中的性能和可靠性有重大影响。多层薄膜局部和整体残余应力的测量至关重要。本研究采用环芯铣削残余应力测量方法，对高功率脉冲磁控溅射 (HiPIMS) 制造的钨/铜 (W/Cu) 铬/铜 (Cr/Cu) 多层薄膜进行残余应力测量。采用聚焦离子束（FIB）环芯铣削结合数字图像相关（DIC）分析位移变换应变，并通过有限元法（FEM）分析应变应力变换校准系数，研究薄层的残余应力。一层又一层地拍电影。研究结果表明，硬薄膜（W、Cr）是多层薄膜结构中残余应力的主要来源，而软薄膜（Cu）的残余应力较低。发现以Cu作为中间层对于控制薄膜的残余应力是有效的。软薄膜封装的硬薄膜比表面有硬薄膜的应力值更小。此外，该研究观察了样品上不同深度和位置的应力梯度和分布，以揭示软硬薄膜之间平衡的工艺参数，并有助于预测由较高应力引起的多层薄膜损伤的位置。压力。