Abstract

Bodies made from elastically stiff material usually bind very weakly unless the surfaces are flat and extremely smooth. In direct wafer bonding flat surfaces bind by capillary bridges and by the van der Waals interaction, which act between all solid objects. Here we study the dependency of the work of adhesion on the humidity and surface roughness in hydrophilic direct wafer bonding. We show that the long-wavelength roughness (usually denoted waviness) has a negligible influence on the strength of wafer bonding (the work of adhesion) from the menisci that form from capillary condensation of water vapor.

Graphic abstract

AFM surface topography for Si(100) wafer

中文翻译：

---

湿度和表面粗糙度对晶圆直接键合的影响

摘要

由弹性刚性材料制成的物体通常结合力非常弱，除非表面平坦且极其光滑。在直接晶圆键合中，平坦表面通过毛细管桥和范德华相互作用结合，作用于所有固体物体之间。在这里，我们研究了亲水直接晶圆键合中粘合功对湿度和表面粗糙度的依赖性。我们表明，长波长粗糙度（通常表示波纹度）对水蒸气毛细管冷凝形成的弯月面的晶圆键合强度（粘附功）的影响可以忽略不计。

图文摘要

Si(100) 晶圆的 AFM 表面形貌