The thermoelectric cooler (TEC) operating under the transient mode showed a stronger short term cooling effect than that of the steady state mode. In this study, a chip cooling experimental setup with the chip modeled by a ceramic heater was constructed using a commercial BiTe-based TEC. A transient three-dimensional numerical model was established for the system optimization. The impacts of the pulse voltage amplitude, pulse voltage trigger time, pulse voltage time span, and the power magnitude of the chip on the peak temperature of the chip were analyzed in detail. The results showed that the experimental and numerical simulations were in high agreement with an error of only 3.6 %. When a pulse voltage of 12 was applied to the TEC, the experimental results showed that the peak temperature of the chip with a pulse power of 48 was reduced by 15.3 , while the simulation results demonstrated a reduction of 15.6 . The increase in the pulse voltage width and the pulse thermal power resulted in a larger temperature reduction. The transient cooling effect of the TEC presented a promising solution for temperature regulation in modern chips operating under dynamic power conditions.

中文翻译：

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瞬态热电冷却对动态功率下芯片温度控制的性能优化

瞬态模式下运行的热电冷却器（TEC）表现出比稳态模式更强的短期冷却效果。在本研究中，使用商用 BiTe 基 TEC 构建了芯片冷却实验装置，其中芯片由陶瓷加热器建模。为系统优化建立了瞬态三维数值模型。详细分析了芯片的脉冲电压幅值、脉冲电压触发时间、脉冲电压时间跨度和功率大小对芯片峰值温度的影响。结果表明，实验与数值模拟吻合较好，误差仅为3.6%。当对TEC施加12℃的脉冲电压时，实验结果表明，脉冲功率为48℃的芯片峰值温度降低了15.3℃，而仿真结果显示降低了15.6℃。脉冲电压宽度和脉冲热功率的增加导致更大的温度降低。 TEC 的瞬态冷却效应为动态功率条件下运行的现代芯片的温度调节提供了一种有前途的解决方案。